Volume -I , Issue -III, February 2014

A KINETIC STUDY OF CURRENT DISTRIBUTION BY ELECTRODEPOSITION IN COPPER COATINGS

Author(s) :

S R RAJKUMAR AND M ALAGAR

Abstract

This model addresses the precise an analytically derived model for the current distribution on a resistive electrode subject to Butler-Volmer kinetics, with parameters typical to copper plating. The deposit thickness uniformity in copper metalized semiconductor wafers is adversely affected by the limited conductivity of the thin copper seed layer. It is noted that, as expected, the current distribution is more uniform when a less conductive electrolyte is used and when the electrode kinetics are slow down. The resistive substrate tends to cause the copper to plate primarily near the terminal contact at the wafer edge. Models for this terminal-effect have been presented for simpler electrode configurations using unrealistically simplified, linear electrode polarization. The predicted current distributions are compared to numerical simulations using electrochemical computer aided design (CAD) software program, is a freeware program written in MATLAB.

Keywords

Deposition kinetics; Numerical modeling, electrode kinetics, electrode polarization, Galvanic electrode position

References
  1. Tobias C. W. and Wijsman R., J. Electrochem. Soc. 100, (1953) 450.
  2. Takahasi K. M., J. Electrochem. Soc. 147(4), 1414-1417 (2000).
  3. MATLAB programming codes are available for individual interpolation models at http://techmatlab.blogspot.in.
  4. Uziel Landau, “Copper metallization of semiconductor interconnects – Issues and Prospects” Proceedings of the Electrochemical Soc., PV -26, 2000,pp. 231-253.
  5. Yezdi Dordi, Uziel Landau, Jayant Lakshminkanthan, Joe Stevens, Peter Hey and Andrew Lipin, “Contact Resistance in Copper Plating of Wafers – Analysis and Design Criteria,” Abstract # 365, The Electrochemical Society Meeting, Toronto, Canada, May 2000
  6. Kanagasabapathy M,Technical computation by MATLAB,MathForum (Research),Drexel university Philedephia,USA,Online: http://mathforum.org/library/view/75575.html
How to Cite this Paper? [APA Style]
S R RAJKUMAR AND M ALAGAR , (2014), A KINETIC STUDY OF CURRENT DISTRIBUTION BY ELECTRODEPOSITION IN COPPER COATINGS, Industrial Science Journal, http://industrialscience.org/Article.aspx?aid=25&vid=3, (February, 2014)
Full Text in PDF

Full Article in PDF Format

Comment on this article...!!!

 
 
 
Previous Comments...
No previous comments.

Archive

Alert Me...!!!

When new article publish, article link will mail to your mail...

Enter Your Name :
Enter Your Email ID :

For Authors

For Readers