Volume -I , Issue -V, June 2014

MIXED SIGNAL CHIPS WITH SUCCESSFULL PCB GROUNDING AND THE PATH OF LEAST IMPEDANCE MATCH

Author(s) :

Farhan Akthar , Awad Bin Abdalla , Syed Amer Ali , Kranthi Kiran and Anvesh Reddy

Abstract

This paper shows the proper PCB grounding for the mixed signal design. For this applications a signal method without cuts in the ground plane allows for successful PCB layouts with this kind of IC. This paper also tells the basics, where the current flows in PCB. Also the descriptions of the components how to place it and minimizing the route signal traces to overcome from the problem of crosstalk. The working of the power supply currents & extended circuits with multiple mixed signal.

Keywords

Mixed signal, Layout, PCB, Grounding, IC, ADC, DAC.

References
  1. Ott, Henry W., Electromagnetic Compatibility Engineering, John Wiley and Sons, Hoboken, NJ, 2009.
  2. Johnson, Howard W., Ph.D. and Graham, Martin, Ph.D., High-Speed Digital Design: A Handbook of Black Magic, Prentice-Hall, Upper Saddle River, NJ, 1993.
  3. Application note 4636, "Avoid PC-Layout Gotchas in ISM-RF Products
How to Cite this Paper? [APA Style]
Farhan Akthar , Awad Bin Abdalla , Syed Amer Ali , Kranthi Kiran and Anvesh Reddy, (2014), MIXED SIGNAL CHIPS WITH SUCCESSFULL PCB GROUNDING AND THE PATH OF LEAST IMPEDANCE MATCH, Industrial Science Journal, http://industrialscience.org/Article.aspx?aid=43&vid=5, (June, 2014)
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